PACK EXPO International 2016, taking place at McCormick Place in Chicago on Nov. 6–9, will serve as a hub innovation across a wide range of industries. PACK EXPO International is North America’s largest processing and packaging event.
Companies have been releasing a wide range of new ovens and proofers suited to snack and bakery operations, and the diversity is sure to cultivate a strong level of appeal across the board. This new range of equipment focuses on ease of use, technical improvements, better sanitary design and new levels of efficiency.
Although Pocky is well known in Japan, it’s just now transitioning to the U.S. snack market. Savvy American consumers may already be familiar with the brand, but previously, one would have had to gone to a specialty market (such as an Asian grocery store) to find it on the shelves.